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发明名称
BONDING WIRE FOR SEMICONDUCTOR DEVICE AND MANUFACUTRING METHOD
摘要
申请公布号
KR900005561(B1)
申请公布日期
1990.07.31
申请号
KR19860002527
申请日期
1986.04.03
申请人
MITSUBISHI METAL CORP
发明人
ORIGAWA MASAKY;HOSOKAWA NAOYUKI;UZIYAMA NAOKI;ONO TOSHIAKI;YOSIDA HIDEAKI
分类号
H01L21/60
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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