| 摘要 |
PURPOSE:To increase tension strength between a polyimide film and wire bonding lands by providing an interlayer insulating film consisting of a polyimide film and an inorganic insulating film and providing the bonding lands in a part of the surface. CONSTITUTION:An NiCr-Su layer is formed on the surface of an alumina substrate 1 by a sputtering process to provide a predetermined thin-film conductor 2. A photosensitive polyimide film 3 is applied thereon and dried. An inorganic insulating film of Ta2O2 4 is formed thereon by a sputtering process to produce an interlayer insulating film 9 together with the polyimide film 3. The film 4 is then plasma etched to pattern the same and the film 3 is patterned to provide contact holes 5. Then, a Ta thin-film resistor 6 and an upper thin-film conductor 7 are superposed thereon and patterned by a photo etching process. Bonding lands 8 are formed in a part of the film 4. |
