发明名称 MOLD CLAMPING APPARATUS FOR MOLDING MACHINE
摘要 A mold clamping apparatus includes a stationary platen, a movable platen, a driving device, a rotational-linear motion transmission mechanism, a braking device, and a mold clamping force applying mechanism. The stationary platen is arranged on a frame and mounts a stationary metal mold for a molding machine. The movable platen is arranged to oppose the stationary platen to move forward/backward with respect to the stationary platen and mounts a movable metal mold. The driving device moves the movable platen forward/backward with respect to the stationary platen. The rotational-linear motion transmission mechanism is arranged between the driving device and the movable platen and converts a rotational torque of the driving device into a linear motion in a moving direction of the movable platen. The braking device is connected to the driving device and brakes a linear motion of the movable platen toward the stationary platen at the end of the linear motion. The mold clamping force applying mechanism applies a mold clamping force to the movable platen upon braking of the braking device.
申请公布号 CA2008609(A1) 申请公布日期 1990.07.30
申请号 CA19902008609 申请日期 1990.01.25
申请人 UBE INDUSTRIES, LTD. 发明人 UENO, TOYOAKI
分类号 B22D17/26;B29C33/22;B29C45/17;B29C45/64;B29C45/66;B29C45/68;(IPC1-7):B29C45/67 主分类号 B22D17/26
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