| 摘要 |
PURPOSE:To mount a chip having extremely many electrodes on a small package by using a connection wiring between a chip and a package base body, together with a line connecting the chip and the package base body via a cap. CONSTITUTION:A first input-output terminal 31 on a semiconductor chip 3 and a first input-output terminal 11 on a package base body 1 are connected by a wiring 5; a second input output terminal 32 on the semiconductor chip 3 ia directly connected with a first bump 41 on a cap 4; a second bump 42 is directly connected with a second input-output terminal 12 on the package base body 1. By this constitution, when sealing material 44 of the cap 4 and sealing material 13 of the package base body 1 are made to abut with each other and sealed, the following can be simultaneously compression-bonded, and directly connected; the first bump 41 of the cap 4 and the second input- output terminal 32 on the semiconductor chip 13; the second bump 42 of the cap 4 and the second input-output terminal 12 on the package main body 1. Thereby, even a chip with extremely many electrodes can be mounted on a small-sized semiconductor package. |
