| 摘要 |
Heat melting type polyamide based adhesive is prepd. by: mixing of 20-65 wt.% of E-caprolactan or C- aminocapronic acid, 20-65 wt.% of amino dodecanic acid or lauryl lactam and 15-60 wt.% of butadiene- acrylonitrile copolymer of formula (I) and/or hexamethylene diamine; on the basis of the mixt., addition of 5-10 wt.% of water, 0.01-0.05 wt.% of org. acid and 0.03-1 wt.% of antimon oxide or germanium oxide; and heating-polymerization of the same at 200-300≦̸C, pressure or not. In formulas, m= integer of 7-10. Pref. butadiene- acrylonitrile copolymer and hexamethylene diamine has 1:1 of equi. mole % ratio.
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