发明名称 SOLDERING METHOD
摘要 PURPOSE:To improve the sound quality of audio apparatus by using the solder produced by melting Cu which attains temp. higher than a saturation point at the melting temp. in the working stage and soldering the work in the molten solder on which intermetallic compds. of Cu are held afloat. CONSTITUTION:For example, a compsn. consisting of 63wt% Sn, 0.7wt% Cu at which it attains temp. higher than the saturated point at the melting temp. in the working stage and the balance Pb is melted uniformly at about 400 deg.C and is cooled, whereby a solder ingot is produced. When such solder ingot is charged into a soldering vessel 2 and is heated and melted to about 250-260 deg.C, intermetallic compds. 1 such as Sn and Cu, Pb and Cu, Sn, Pb and Cu float in the molten solder 3. The work is welded by such solder.
申请公布号 JPS5838693(A) 申请公布日期 1983.03.07
申请号 JP19810135562 申请日期 1981.08.31
申请人 PIONEER KK 发明人 KITA KENICHI
分类号 B23K1/08;B23K35/26;H05K3/24 主分类号 B23K1/08
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