| 摘要 |
<p>PURPOSE:To obtain a thick film conductor having conducting properties, surface smoothness, adhesiveness, film thickness uniformity, etc., by a method wherein extra-fine particles of metal single substance or its carbide, oxide or nitride are dispersed in thin film material containing organic compound of noble metal. CONSTITUTION:A metal screen mask 13 having a printing hole 12 is placed tightly on the aluminum electrode 7 of a silicon chip 6. After printing paste containing organic noble metal mixed with extra-fine metal particle is applied by printing, the printing paste is heated while ultraviolet radiation is applied to form a thick film bump 10. As the extra-fine metal particles 8, extra-fine metal particles of high conductivity metal such as gold, silver, copper or palladium are recommended. A semiconductor component manufactured like this is turned upside down and mounted on an external circuit board 14 and bonded to it with insulating resin 16 while a pressure is applied to obtain a highly reliable connection between the aluminum electrode 7 and an external electrode 15.</p> |
