| 摘要 |
<p>PURPOSE:To reduce a multilayer interconnection board in cost by a method wherein a bonding pad is composed of two or more pad sections connected with each other through contact via-holes and a bonding pad layer consisting of two adjacent pad sections out of the pad sections and an insulating layer interposed between them. CONSTITUTION:A bonding pad 11 connected to a lead 7 is composed of three pad sections 13 connected with each other though contact via-holes 12 and a bonding pad layer provided with two adjacent pad sections 13 out of the pad sections 13 and an insulating film 14 of polyimide resin interposed between the adjacent pad sections 13, which is provided onto a wiring layer 1. And, an electronic component 6 is mounted on the wiring layer 1 of a multilayer interconnection board in such a manner that the corresponding lead 7 is connected to a second pad section 13b. On the other hand, when the electronic component is dismounted from the wiring layer 1, the lead 7 is disconnected from the second pad 13b. By this setup, when the electronic component 6 is re-mounted, an additional multilayer interconnection board can be dispensed with, so that a multilayer interconnection board of this design can be reduced in cost.</p> |
