| 摘要 |
<p>The multilayer ceramic copper circuit baord is made by: (a) forming a multilayer structure of layers of copper-based paste patterns and layers of glass-ceramic, the glass-ceramic comprising a mixt. of 3 to 75 wt.% mullite, 25 to 97 wt.% borosilicate glass with a softening temp. of at least 720 deg.C, and 0 to 70 wt.% quartz glass, all blended with a thermally depolymerisable resin as binder; (b) prefiring the multilayer structure in a water-contg. inert atmos. having a partial pressure of 0.005-0.3 atmos. so as to eliminate the binder; (c) firing the multilayer structure in a water-free inert atmos. so as to sinter the glass-ceramic. Pref. the resin is poly- alpha-methylstyrene.</p> |
