| 摘要 |
PURPOSE:To reduce a heat resistance and to prevent the bent of inner leads due to the flow of a resin at the time of resin sealing by a method wherein the plate thicknesses of the inner lead parts of a lead frame are made thicker than those of the outer lead parts of the frame. CONSTITUTION:A semiconductor chip 3 is connected electrically with inner lead parts 5 of a lead frame 1 by wires 4 for connector use, outer lead parts 7 of the frame 1 are exposed outside of a resin sealed body 6 and the parts 7 are bent to the base of the body 6. In this case, the plate thicknesses of the parts 5 are constituted thicker than those of the parts 7. Thereby, the contact areas of the parts 5 with the body 6 are increased, heat which is generated in a package is easily dissipated and a heat resistance can be reduced. Moreover, the bent of the inner leads due to the flow of a resin at the time of transfer molding is also decreased. |
