METHOD OF MOUNTING ELECTRONIC COMPONENT

摘要

The mounting method holds the electronic components (1) to be automatically placed onto a substrate (2) on an adhesive foil (5) which is elastic. Two, or more, prongs (8) push either side of a components forcing it down onto the substrate. The ends of the prongs pierce the adhesive foil and bear against the component. An adhesive on the substrate attaches the component to the substrate as the prongs exert pressure. The prong mechanism (7) then lifts, and the adhesive foil peels off the component which is now adequately located in the correct position on the substrate. The prongs are lifted out of the foil, and a further cycle can then commence.