| 摘要 |
<p>PURPOSE:To prevent defect from being produced at a chip cut section by allowing polyimide to absorb lateral vibration of a blade by coating the rear surface of a semiconductor substrate with polyimide prior to dicing. CONSTITUTION:The rear surface of a semiconductor substrate 1 on which a device 2 is coated with polyimide 5 into thickness of 1-40mum, and placed on glue part 10a of a dicing tape 10 for bonding. The dicing lien 3 is cut away therealong using a blade, to separate a chip 6. The rear surface of the semiconductor substrate 1 is coated with the polyimide 5 prior to the dicing in such a manner. This prevents a crack from being produced at the cut section of the chip.</p> |
