METHOD FOR ROUGHENING CERAMIC SUBSTRATE SURFACE

摘要

A ceramic circuit board is manufactured from a ceramic substrate which is dipped in a roughening bath of phosphonic acid at 250-360 deg. C for 3-10 minutes and then treated by an actuating soln. to give the surface catalytic properties. Conductor layers are then deposited by electroless plating on the roughened surface and are heat-treated at 500-1083 deg. C. The layers are porous, to allow escape of gas and avoid formation of pores when the board is fired in the formation of resistances. The ceramic substrates provide better adhesive for metal conductor layers used as interconnection pattern for hybrids.