| 摘要 |
PURPOSE:To increase the positional accuracy of die-bonding by a method wherein a device, with which the position and the condition of the die-bonding after mounting are automatically detected, is provided and the amount of detection is computed and fed back. CONSTITUTION:Die-mounting parts 10a and 10a' are fed at equal intervals. A mounting agent injection head 2 is provided on a die-mounting section 10a in the state wherein a lead frame 1 is at a standstill, and a controller 3 for mounting agent injection quantity, which comes down when the mounting agent is injected, is provided, a mount head 4 is attached on an XY table 4a, picks up a die 11 located on another table 5 and carried it to the die-mounting part 10a'. An ITV camera 6 is installed on a die-mounting part 10a'' which is located after several die-mounting parts. The position where a die is mounted, the quantity of mounting agent and the deffective mounting of a die are detected and the result is inputted to a central controller 7, an arithmetic oprational processing is performed on the above data, and the mounting agent injection quantity of the controller 3 and the amount of performance of the mount head 4 are corrected by performing a feed back. |
