发明名称 ENHANCED AIR FIN COOLING ARRANGEMENT FOR A HERMETICALLY SEALED MODULAR ELECTRONIC COLD PLATE UTILIZING REFLUX COOLING
摘要 <p>A modular reflux cooling plate (10) having a condenser region (11) above the boiling channels (12) or above and below (11, 24) the region (11), boiling channels (12) and downcomers (16) which effect reflux cooling of electrical power modules used in aircraft and the like. Air flow fins (18) are arranged adjacent the condenser (11) or condensers (11, 24) and the boiling channels (12) to effect cooling of a coolant vapor which has entered the condenser (11) after being boiled from a liquid state in the boiling channels (12) as a result of the heat generated by one or more power modules affixed to an end plate (14) by any suitable means and to provide a parallel heat transfer path which shares the heat transfer task with the reflux cooling during normal system operation and which provides emergency heat transfer when reflux cooling is not available.</p>
申请公布号 WO1990008400(A1) 申请公布日期 1990.07.26
申请号 US1989005636 申请日期 1989.12.08
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