| 摘要 |
<p>PURPOSE:To enable a circuit board constituting an IC card to be easily sealed by a resin by assembling a plastic frame onto a circuit board supporting electronic parts mounted thereon, and integrally molding an outer part of the assembly from a resin. CONSTITUTION:A plastic frame 4 is assembled by fitting pins 6 into a plurality of positioning holes 5 provided in a circuit board 1. The plastic frame 4 is provided with many recessed parts 7 and holes 8 on the inner side thereof, avoiding electronic parts 2 on the circuit board. The recessed parts 7 and the holes 8 are provided close to the electronic parts in order to minimize the amount of air involved. The plastic frame 4 functions to shield the effects of heat at the time of integral molding of the outer part. In the condition where the plastic frame 4 is assembled on the circuit board 1, the outer part of the assembly is integrally molded from a resin, whereby an outer casing 10 is formed, and predetermined size, profile and appearance of an IC card are obtained. Thus, an operability is enhanced, and an improvement on an economical basis can be achieved by not filling with an expensive epoxy resin.</p> |
