METHOD AND APPARATUS FOR ETCHING COMPOUND SEMICONDUCTOR,申请号JP19890005934-传众专利搜索

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发明名称	METHOD AND APPARATUS FOR ETCHING COMPOUND SEMICONDUCTOR
摘要
申请公布号	JPH02188917(A)	申请公布日期	1990.07.25
申请号	JP19890005934	申请日期	1989.01.17
申请人	HIKARI GIJUTSU KENKYU KAIHATSU KK	发明人	AKITA KENZO;SUGIMOTO YOSHIMASA;TANETANI MOTOTAKA;HIDAKA HIROMI
分类号	H01L21/302;H01L21/3065	主分类号	H01L21/302
代理机构		代理人
主权项
地址

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