| 摘要 |
<p>PURPOSE:To improve migration resistance to copper under high-temperature conditions, and to reduce the deterioration of a copper layer by forming a specific foundation layer between a resin board and a copper or copper alloy layer lead layer. CONSTITUTION:A base material is composed of a polyimide group resin board such as a polyimide film 13, foundation layers 12 shaped onto one surface or both surfaces of the resin board and copper or copper alloy layers 11 formed onto the foundation layers 12. A barrier layer having at least one selected from a group consisting of nickel, chromium and titanium is used as the foundation layer 12. Accordingly, the foundation layers 12 are formed, thus acquiring a multiple-pin TAB(Tape Automated Bonding) tape carrier in which copper and a polyimide are not reacted, even under a high-temperature state, the migration of copper is not generated and the pitches of inner leads are narrowed by employing the base material for the TAB tape carrier and an area TAB tape carrier.</p> |
