发明名称 |
METHOD OF COUPLING SEMICONDUCTOR CHIP TO ITS SUPPORT |
摘要 |
<p>Method of joining a semiconductor chip to a chip carrier by cementing or soldering which includes treating an area of the semiconductor chip to be joined to the carrier with a laser beam, adjusting the energy of the laser beam to produce depressions by localizing melting of the semiconductor material of the chip and to at least partially pile melted semiconductor material at the edge of the depression, and applying cement or solder between the treated area of the semiconductor chip and the carrier.</p> |
申请公布号 |
JPS5842244(A) |
申请公布日期 |
1983.03.11 |
申请号 |
JP19820142568 |
申请日期 |
1982.08.17 |
申请人 |
SIEMENS SCHUCKERTWERKE AG |
发明人 |
RADEIMU BADARETSUKU;UERUNAA BAUMUGARUTONAA;DAFUITSUTO KUTSUTAA |
分类号 |
H01L21/52;H01L21/268;H01L21/58;H01L21/60 |
主分类号 |
H01L21/52 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|