| 摘要 |
A sealing frame arrangement is disclosed for creating a hermetic seal between two components or bodies such as a connector and heat sink module of an integrated circuit package. The frame members are configured to fit together along facing surfaces and to be joined to the two bodies along the inner edge of their outside (non-facing) surfaces. The sealing arrangement is completed by a third seal formed along the outer facing edge of the frames. The frames extend a sufficient distance beyond the two components to permit severing the frames inside the third seal and resealing. Preferably, the frames are of sufficient width to provide a multiplicity of sealing regions so that the third seal can be broken and resealed a number of times. The seal frames may be of stepped or corrugated configuration in which the individual seals are formed along the mating steps.
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