| 发明名称 |
Solder flow well for reflowing solder of multipin components |
| 摘要 |
A solder well configured to abut and enclose the though hole pattern on a printed circuit board to allow the reflow of solder and removal of a multipin electronic component without affecting the integrity of adjacent solder joints of components disposed within or adjacent the through hole pattern.
|
| 申请公布号 |
US4942997(A) |
申请公布日期 |
1990.07.24 |
| 申请号 |
US19870092799 |
申请日期 |
1987.09.03 |
| 申请人 |
FORD MOTOR COMPANY |
发明人 |
SINKUNAS, PETER J.;RITTER, RODNEY L.;ALTPETER, JAMES E. |
| 分类号 |
B23K3/06;H05K3/34;H05K13/04 |
主分类号 |
B23K3/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
