发明名称 |
Cathode sputtering system |
摘要 |
A cathode sputtering system for coating substrates in a vacuum chamber in which a rotating substrate carrier is accommodated and comprises at least one conveyor spoon. The conveyor spoon comprises a substrate receptacle member and an arm attached between the receptacle member and a rotating disk. The arm preferably comprises two leaf springs arranged parallel to one another. During the sputtering process, a pressure plate presses the substrate receptacle member and the substrate against a mask that is part of the cathode station. As a result, a cathode vacuum space is formed that is isolated from the vacuum space of the system.
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申请公布号 |
US4943363(A) |
申请公布日期 |
1990.07.24 |
申请号 |
US19890377132 |
申请日期 |
1989.07.10 |
申请人 |
LEYBOLD AKTIENGESELLSCHAFT |
发明人 |
ZEJDA, JAROSLAV;SCHUHMACHER, MANFRED |
分类号 |
C23C14/34;B65G49/07;C23C14/56;H01L21/683 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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