| 摘要 |
<p>PURPOSE:To prevent electrostatic destruction of a device by constituting the device so that the same is neither splashed with water nor covered with cut pieces of a wafer which possess an electrostatic charge, by placing the wafer on the upside of a blade. CONSTITUTION:A wafer 1 is fixed to a stage 5 downward. The wafer 1 is diced by placing the same on the upper part of a disclike blade 2 rotating at a high speed. At the time of dicing, cooling water abuts against the blade 2 and wafer 1 by passing through a cooling water nozzle 3 and a flow of the cooling water drops to a blade 2 side. Also the cut pieces of the wafer 1 generated at the time of the dicing drops to the blade 2 side of a flowing direction 4 of the cooling water. With this construction, the cooling water and the cut pieces of the wafer having an electrostatic charge generated at the time of the dicing drop on the blade side, and does not arrive at the surface of the wafer.</p> |
