| 摘要 |
The present invention relates to a plasma treating method and apparatus therefor, wherein a plasma treating method is carried out in which an electric field is generated between the electrodes of parallel plate electrodes (anode and cathode), and a magnetic field starting from the anode side, toward the cathode side, the other of said parallel plate electrodes, and back to the anode side, is used. The magnetic field has relatively short lines of magnetic force where it orthogonally intersects the electric field, near the cathode, as compared to that of lines of magnetic force parallel to the electric field, so as to make a cycloidal motion of electrons restricted and to cause mainly a cyclotronic motion of electrons to occur in large quantities. A power supply is connected to the cathode, one of said parallel plate electrodes, and a magnetic field generating means is provided on the anode side, the other of said parallel plate electrodes, at the counter-cathode side thereof, the said magnetic field generating means having NS poles in proximity to each other to provide the previously discussed magnetic lines of force, so as to make the cycloidal motion of electrons restricted and to cause the cyclotronic motion of electrons to occur in large quantities. By use of such method and apparatus, it is made possible to facilitate a treatment of a specimen at a high rate and uniformly without damaging the specimen.
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