| 摘要 |
Provided herein are conductive die attach films having advantageous properties for use in a variety of applications, e.g., for the preparation of large die semiconductor packages. Also provided are formulations useful for the preparation of such films, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In additional aspects, the invention further relates to articles comprising such conductive die attach films adhered to a suitable substrate therefor. |
| 主权项 |
1. A composition comprising:
a first maleimide, nadimide or itaconimide, wherein said first maleimide, nadimide or itaconimide has an aromatic backbone, and the degree of substitution of imide moieties on the backbone of said first maleimide, nadimide or itaconimide is at least 0.5 imide moieties per repeat unit of said backbone, a second maleimide, nadimide or itaconimide, wherein said second maleimide, nadimide or itaconimide has a flexible aliphatic or aliphatic/aromatic backbone, wherein the backbone of said second maleimide, nadimide or itaconimide includes straight or branched chain hydrocarbyl segments, wherein each hydrocarbyl segment has at least 20 carbons, a first epoxy resin, wherein said first epoxy resin is rubber or elastomer-modified, a second epoxy resin, wherein said second epoxy resin has a flexible aliphatic or aliphatic/aromatic backbone, wherein the backbone of said second epoxy resin includes straight or branched chain hydrocarbyl segments, wherein each hydrocarbyl segment has at least 20 carbons, backbone, a conductive filler, a curing agent; and optionally a non-reactive organic diluent therefore;wherein:
said composition, when cured, has a modulus less than about 1 GPa when tested by dynamic mechanical analysis (DMA) at 260° C. |
