| 摘要 |
PURPOSE:To provide a resin composition for semiconductor sealing use high in glass transition point, excellent in moisture resistance and low stress characteristics, comprising, as essential components, a polyaminomaleimide resin, an adduct of liquid polybutadiene and epoxy resin, and inorganic filler. CONSTITUTION:The objective composition comprising, as essential components, (A) 100 pts.wt. of a polyaminomaleimide resin prepared by reaction between bismaleimide and/or its derivative and an aromatic diamine, (B) 10-50 pts.wt. of an adduct prepared by reaction between a polybutadiene of the formula (n is 5-50) and an epoxy resin (e.g. bisphenol A diglycidyl ether) at the molar ratio epoxy group/carboxyl group = 2-10 in the presence or absence of a catalyst (e.g. triethanolamine) at 120-200 deg.C until rise of the melt viscosity stops, and (C) 50-600 pts.wt. of an inorganic filler (e.g. silica powder). |
