| 摘要 |
<p>PURPOSE:To facilitate the manufacture of a semiconductor device of this design, to prevent the occurrence of a defective, and to improve the device in reliability by a method wherein a light emitting section and a photodetective section are fitted to two lead frames respectively, which are formed by bending the tips of tab sections and lead wire sections nearly at a right angle, and these two lead frames are provided to a molding die so as to make the element sections face each other and molded with transparent and non-transparent resin. CONSTITUTION:Two thin plates are punched out and the tips of them are bent almost at a right angle to form two lead frames 30. Next, a light emitting element 1 is mounted on the face of a bent tab section 40 of either of the lead frames 30 and fixed, where the above face faces outward, and a gold wire 6 is connected to a lead wire section 30b for the formation of a light emitting section. The same as above, a photodetective element 2 is mounted on and fixed to the other lead frame 30 to form a photodetective section. Then, both the lead frames 30 are provided inside a drag 10 of a mold die making the light emitting element 1 and the photodetective element 2 face each other. A cope 11 of the molding die is mounted after the lead frames 30 have been provided and the elements 1 and 2 are molded with a transparent resin 7 transmissive of the wavelength of the light emitting element 1 and moreover the circumference of the transparent resin 7 is molded with a non-transparent resin 8 using another molding die.</p> |
