发明名称 CHIP ON CHIP SEMICONDUCTOR DEVICE
摘要 The circuit applies to multi-layer chip on chip devices in which pretesting of component chips presents problems of providing large area contacts for test probes, and clamping gate inputs. Two chips (100,200) contain functional circuits (103, 203 etc.) and auxiliary switching circuits (S1,S2) selecting a test or a normal condition under control of control inputs (C1,C2). In the test condition with control inputs high, the inputs and outputs of each functional circuit are looped togeter while in the normal condition, inputs and outputs are routed to their corresponding connections on the partner chip.
申请公布号 KR900005148(B1) 申请公布日期 1990.07.20
申请号 KR19850007311 申请日期 1985.10.04
申请人 FUJITSU CO., LTD. 发明人 FUJIYI SIGERU
分类号 G01R31/26;G01R31/3185;H01L21/66;H01L21/822;H01L27/00;H01L27/04;(IPC1-7):H01L27/00 主分类号 G01R31/26
代理机构 代理人
主权项
地址