| 摘要 |
PURPOSE:To restrain a layout area around a bonding pad from increasing, to make a semiconductor device small in chip size, to improve chips in yield per wafer, and to reduce the semiconductor device in cost by a method wherein at least a part of an input protective circuit is arranged under a bonding pad section. CONSTITUTION:An input protective circuit is formed of a series circuit composed of a protective resistor formed of a polycrystalline resistive layer 103 and a protective diode formed of an N<+> impurity diffusion layer region 106 and a P-type silicon substrate 113. And, the input protective circuit has such a layout structure that most of it is located under a bonding pad section. By this setup, a chip can be reduced in size and increased in yield par wafer. |
