| 摘要 |
PURPOSE:To enable the thickness of semiconductor films to be controlled evenly and accurately by a method wherein, when quartz glasses are arranged on the peripheral part of spot facing parts on wafer mounting surfaces and then the wafers are mounted on the spot facing parts, the surfaces of wafers are almost leveled with the surfaces of the quartz glasses. CONSTITUTION:Spot facing parts 17 for mounting wafers 5 are provided on the wafer mounting surfaces of a susceptor 12 while quartz glasses 16 are arranged in the recesses on the susceptor main body on the peripheral parts of the spot facing parts 17 to be buried therein or bonded thereto. In such a constitution, when wafers 5 are mounted on the spot facing parts 17 of the susceptor 12, the surfaces of the wafers 5 are almost leveled with the surfaces of the quartz glasses 16. |
