| 摘要 |
PURPOSE:To facilitate a modification of the number of bondings by a method wherein a wire bonding device is constituted in such a way that one bonding point is controlled on the basis of one line in wire bonding control data. CONSTITUTION:In case the number of bondings and the number of total bondings are respectively assumed to be (n) and (m), the (n) is initialized to n=1 and thereafter, nth-line data is read out from wire bonding control data. Then, a wire bonding device is moved to a first point using read-out positional information Pn-1, executes a bonding at the first point on the basis of control information Bn-1 to execute a wire bonding start treatment and forms a first bonding 26 to perform a control at the time of start of wire bonding. Then, while executing a loop control to form a first loop 27 on the basis of positional information Pn-2, the device is moved to a second point and executes a second bonding 28 on the basis of control information Bn-2 to perform a control at the time of continuation of wire bonding. Then, while executing a loop control to form a second loop 29 on the basis of positional information Pn-3, the device is moved to a third point and executes a bonding at the third point on the basis of control information Bn-3 to perform a wire bonding end treatment. Thereby, when the number of bondings per wire is modified, a modification of a matrix structure consisting of data becomes unnecessary. |
