发明名称 RECOGNITION DEVICE FOR SEMICONDUCTOR WAFER
摘要 <p>PURPOSE:To easily and accurately perform binarization processing by providing a wafer set part to the head part of a wafer installation base and making the size of the wafer set part smaller than the external diameter of a wafer to be recognized. CONSTITUTION:The wafer set part which has a surface smaller than the external diameter of the wafer 1 to be set is formed at the head part of the wafer installation base 2. The edge part of the external diameter of the wafer 1 is not mounted directly in contact with the set part 6. Consequently, none of the reflected light of irradiating light from illuminator 4 and 5 is made incident on the edge part of the wafer 1 from the set part 6. An image of the edge part is therefore a high-contrast, sharp image and the binarization processing of the output of a CCD camera 3 which picks up the high-contrast, sharp image has no room for an error. The wafer 1 is therefore accurately recognized.</p>
申请公布号 JPH02184709(A) 申请公布日期 1990.07.19
申请号 JP19890003816 申请日期 1989.01.12
申请人 MATSUSHITA ELECTRON CORP 发明人 SAKAI MASATO
分类号 G01B11/30;G01N21/88;G01N21/956;H01L21/68 主分类号 G01B11/30
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