| 摘要 |
PURPOSE:To stabilize an electrical connection contact against the generation of thermal and mechanical stress at the time of mounting and after mounting by forming the contact region of two-layer structure having a projection-shaped contact top section composed of a conductive resin having resiliency onto the electrode pad of a semiconductor chip. CONSTITUTION:Electrical connection contacts 4 consisting of the upper and lower two-layer structure of contact bottoms 4a and contact top sections 4b corresponding to input/output electrode pads 3 are shaped to the input/output electrode pads 3 on a semiconductor chip 1. Consequently, the electrical connection contacts 4 are brought into contact firmly with conductor terminal sections 6 on a circuit substrate 5 by pushing by utilizing shrinkage stress internally existing in an insulating bonding resin 7, and conduct electrical connection. Accordingly, connection between electrodes can be formed with excellent reliability even the reception of stress-strain such as thermal stress. |
