| 摘要 |
PURPOSE:To stabilize structure to the generation of thermal and mechanical stress, and to improve the reliability of connection by installing a reinforcing section composed of an insulating bonding resin between a semiconductor chip and a circuit substrate and forming the connection of the semiconductor chip and the circuit substrate in a compression-bonded junction utilizing the elasticity of a projection-shaped contact. CONSTITUTION:Projection-shaped connecting contacts consisting of the upper and lower two-layer structure of contact bottom sections 4a and contact top sections 4b are constituted onto the input/output electrode pads 3 of a semiconductor chip 1. Connection is conducted by the contact bond of the contact top section 4b having resilient properties and a conductor terminal section 6 at that time, and a reinforcing layer made up of a bonding resin 7 having insulating properties is organized between the circuit substrate 5 and the semiconductor chip 1. That is, the semiconductor chip 1 and the circuit substrate 5 are fixed stably by the insulating bonding resin 7, and the connection of the conductor terminal section 6 and the projection-shaped contact maintains the state of contact bond by the resilient properties of the contact top section 4b. Accordingly, a device is stabilized to thermal and mechanical stress, and electrical connection among finely and densely formed electrodes is joined with excellent reliability. |
