发明名称 |
EASILY OPENABLE HEAT-SEALING RESIN COMPOSITION |
摘要 |
PURPOSE:To improve heat resistance, peeling strength and interfacial peelability by incorporating a specified ethylene-alpha-olefin copolymer, a propylene-ethylene copolymer and a low-density PE. CONSTITUTION:40-90wt.% ethylene-alpha-olefin copolymer with a density of 0.920 or higher (e.g. ethylene-butene-1 copolymer), 5-40wt.% propylene-ethylene copolymer with an ethylene content of 4-15wt.% and 5-40wt.% low-density PE with a density of 0.930 or lower are melt-kneaded and made into a film of a thickness of 2-100mum. The film is then laminated with a base material. |
申请公布号 |
JPH02185547(A) |
申请公布日期 |
1990.07.19 |
申请号 |
JP19890005818 |
申请日期 |
1989.01.12 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
TSUCHIYA HIROTAKA;YAMAMOTO HIRANAO |
分类号 |
C08L23/08;C08L23/00;C08L23/16 |
主分类号 |
C08L23/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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