发明名称 EASILY OPENABLE HEAT-SEALING RESIN COMPOSITION
摘要 PURPOSE:To improve heat resistance, peeling strength and interfacial peelability by incorporating a specified ethylene-alpha-olefin copolymer, a propylene-ethylene copolymer and a low-density PE. CONSTITUTION:40-90wt.% ethylene-alpha-olefin copolymer with a density of 0.920 or higher (e.g. ethylene-butene-1 copolymer), 5-40wt.% propylene-ethylene copolymer with an ethylene content of 4-15wt.% and 5-40wt.% low-density PE with a density of 0.930 or lower are melt-kneaded and made into a film of a thickness of 2-100mum. The film is then laminated with a base material.
申请公布号 JPH02185547(A) 申请公布日期 1990.07.19
申请号 JP19890005818 申请日期 1989.01.12
申请人 DAINIPPON PRINTING CO LTD 发明人 TSUCHIYA HIROTAKA;YAMAMOTO HIRANAO
分类号 C08L23/08;C08L23/00;C08L23/16 主分类号 C08L23/08
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