THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE PREPARED THEREFROM

摘要

PURPOSE:To make the compsn. suitable for a low permittivity laminating material wherein a high density wiring which is the same level as that of polyimide laminating material is possible and which has flame retardancy by compounding a prepolymer consisting of a poly(p-hydroxystyrene) deriv. with an epoxy- modified polybutadiene, an arom. maleimide and dicyandiamide. CONSTITUTION:A thermosetting resin compsn. is prepd. by compounding a prepolymer (A) consisting of a poly(p-hydroxystyrene) deriv. of formula I (wherein A is a halogen; R1 is a 2-4C alkyl or alkanoyl; m is 1-4; n is 1-100), an epoxy-modified polybutadiene (B) of formula II (wherein B is a glycidyl ether type epoxy copolymer; n is 4-100), an arom. maleimide compd. (C) of formula III (wherein R2 is an arom. group; n is 1-4) and dicyandiamide (D). The compounding ratio of each component is such that A is 10-60wt.%; B is 10-60%; C is 20-70% and D is 0.3-1.5 equivalent% based on one equivalent of the epoxy group.