| 摘要 |
<p>PURPOSE:To make a card still thinner, to eliminate the warpage of the card, to enhance reliability and to increase a degree of freedom from the aspect of design effect by providing an electrode terminal to the surface of a terminal board and connecting the connecting pin protruding from the side part of said board to the circuit wiring from the rear of the terminal board while setting the upper surface height position of an IC to an intermediate position and embedding the IC and the terminal board in a card substrate so as to expose only the electrode terminal part. CONSTITUTION:Circuit wiring 13 is applied to the rear of a terminal board 12 and electrode terminals 14 for external connection are provided to the front surface thereof and both of therm are connected by through-holes 15. The connection pin 11a of an IC 11 is connected to the circuit wiring by soldering. By this method, the upper surface height position of the IC 11 is below the surface of the terminal board 12 and set to the intermediate position of the thickness of said board 11 and a card becomes thin. The IC 11 and the terminal board 12 are embedded by the molding of a synthetic resin to form a card substrate 16 wherein the electrode terminals 14 are exposed and a pair of guide grooves 16a are formed to one end part of said card substrate 16 on both sides thereof in a card inserting and drawing direction at a depth reaching the rear of the terminal board 12 from the rear of the card substrate 16 and prevent erroneous insertion reversing the front and rear surfaces of an IC card when the IC card is to be inserted in and connected to an external apparatus.</p> |
