发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION |
摘要 |
<p>The invention provides a photosensitive resin composition suitable for a relief printing plate having good resistance to a water based ink, for which water or a water like solvent can be employed as a developing solution. The resin composition comprises (i) a polymer having a molecular weight of 5,000 to 500,000 which contains an amino group and a polymerizable double bond moiety: (ii) a monomer having an .alpha.,.beta.-ethylenically unsaturated bond and a free acid group which can quaternize the nitrogen atom of the polymer (i); (iii) a photopolymerizable unsaturated compound, and (iv) a photopolymerization initiator.</p> |
申请公布号 |
CA1271870(A) |
申请公布日期 |
1990.07.17 |
申请号 |
CA19860501675 |
申请日期 |
1986.02.12 |
申请人 |
NAPP SYSTEMS (USA) INC. |
发明人 |
MAMORU, SEIO;KUSUDA, HIDEFUMI;KAWABATA, MASAMI |
分类号 |
C08F20/00;A63F9/24;C08F2/44;C08F2/50;C08F20/26;C08F20/38;C08F20/52;C08F30/00;C08F30/02;C08F220/00;C08F220/04;C08F220/26;C08F220/38;C08F220/58;C08F230/02;C08F290/12;G03F7/00;G03F7/004;G03F7/027;G03F7/033;G03F7/038;H01L21/027;(IPC1-7):C08F2/50 |
主分类号 |
C08F20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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