Procedure for manufacture of multi-strata hybrid circuits of sintered assembly at low temperature and corresponding equipment

摘要

Procedure for manufacture of multi-strata hybrid circuits of sintered assembly at low temperature and corresponding equipment. The objective is to make possible a multi-strata monolithic structure in order to achieve a high density of interconnection between electronic components. In a first phase the perforation of guide holes and interconnection holes is executed together with the cutting of the unsintered alumina 13 by means of a work bench 10 and a laser. The filling of the interconnection holes 2 with conductive paste is carried out with a mask 18 in which the interconnection holes are made by laser, using a further work table 19. The conducting tracks 3 are silk-screened onto each sheet and they are pressed 5 determining the multi-strata structure. The organic products are removed by calcination 6. The sintering is carried out 7 and the separation of each of the individual circuits obtained in one single procedure is realised by means of a preincision by laser. <IMAGE>