发明名称 THERMOSETTING RESIN COMPOSITION
摘要 PURPOSE:To obtain a composition excellent in processability, heat resistance, humidity resistance, electrical insulation properties and low stress properties by mixing a partially allyl-etherified phenolic novolac with a polymaleimide compound and a specified silicone resin. CONSTITUTION:A thermosetting resin composition comprising a partially allyl- etherified phenolic novolac (A), a polymaleimide compound (B) having at least two maleimide groups in the molecule and a silicone resin (C) of formula I or II (wherein R1 and R2 are each a methyl or a phenyl; R3 is H, an amino or an epoxy functional group; and l and m are each 0-400). In the above resin composition, the components may be in the form of a prepolymer prepared by prereacting phenolic novolac resin (A) modified with silicone resin (C) with polymaleimide resin (B). In this way, the moldability can be further improved, and a morphologically uniform cured product can be obtained to enhance the featured of this composition.
申请公布号 JPH02180952(A) 申请公布日期 1990.07.13
申请号 JP19890091554 申请日期 1989.04.10
申请人 SUMITOMO CHEM CO LTD 发明人 SHIOMI HIROSHI;KAMIO KUNIMASA;HARAGUCHI SATORU;NAITO SHIGEKI
分类号 C08L61/14;C08L61/04;H01L23/29;H01L23/31 主分类号 C08L61/14
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