摘要 |
PURPOSE:To obtain a composition excellent in processability, heat resistance, humidity resistance, electrical insulation properties and low stress properties by mixing a partially allyl-etherified phenolic novolac with a polymaleimide compound and a specified silicone resin. CONSTITUTION:A thermosetting resin composition comprising a partially allyl- etherified phenolic novolac (A), a polymaleimide compound (B) having at least two maleimide groups in the molecule and a silicone resin (C) of formula I or II (wherein R1 and R2 are each a methyl or a phenyl; R3 is H, an amino or an epoxy functional group; and l and m are each 0-400). In the above resin composition, the components may be in the form of a prepolymer prepared by prereacting phenolic novolac resin (A) modified with silicone resin (C) with polymaleimide resin (B). In this way, the moldability can be further improved, and a morphologically uniform cured product can be obtained to enhance the featured of this composition. |