发明名称 RESIN STRUCTURE FOR MODEL MOLD
摘要 PURPOSE:To obtain the title structure which is inexpensive, free of dimensional changes, good in machinability and capable of high-speed machining by expanding and curing a phenolic resol, a blowing agent and a curing agent so as to obtain a foam of a specified bulk density and a specified water content. CONSTITUTION:A phenol is condensed with an aldehyde in a molar ratio of 1.1-1.8 in the presence of a catalyst, and the reaction mixture is neutralized and dehydrated in vacuo to obtain a phenolic resol (A) of a solids concentration of 60-90wt.% and a viscosity (at 25 deg.C) of 100-10000cPs. 100 pts.wt. said resol is mixed with 0.1-20 pts.wt. blowing agent desirably of an evaporation type (e.g. trichloromonofluoromethane), 0.1-30 pts.wt. curing agent (e.g. p- toluenesulfonic acid) and optionally a foam stabilizer, a filler, etc., and agitated, expanded and cured to obtain the title structure comprising a phenolic resin foam of a bulk density of 0.3-0.6g/cm<3> and a water content of 5-15wt.%.
申请公布号 JPH02180939(A) 申请公布日期 1990.07.13
申请号 JP19880335040 申请日期 1988.12.29
申请人 MITSUI PETROCHEM IND LTD 发明人 KATSURA SHINRO;SAEKI AKIYOSHI
分类号 C08J9/14;C08L61/04;C08L61/06;C08L61/10 主分类号 C08J9/14
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