| 摘要 |
PURPOSE:To increase a pad surface area and easily raise bonding strength between a bump and the pad upon forming a bump structure by arranging another wiring layer on the lower portion of the pad. CONSTITUTION:A wiring different from a pad is arranged on the lower layer portion of the pad. More specifically, polycrystalline silicon 2 is wired into a double box shape which is covered with an insulating film 5 to construct the pad with aluminum 1, and portions other than an opening section 3 is covered with a protective film 4. Since there is partly existent the polycrystalline silicon 2, the aluminum 1 is made uneven. Hereby, bonding strength of a bump electrode 6 formed on the aluminum 1 is increased, and a surface layer of the aluminum 1 is increased provided the aluminum 1 has a more complicated uneven structure by disposing many rectangular polycrystalline silicons 2. |
