The semiconductor encapsulation comprises inner and outer layers, the semiconductor element (1) embedded in the soft inner layer with the outer comprising a rigid plastics layer. The two layers may also exhibit differing heat expansion coefficients. The semiconductor element (1) comprises an L.E embedded in a transparent silicon or epoxy resin and contacting a metal plate (4) acting as a contact carrier with attached terminal pins (5) projecting from the opposite face. A further terminal pin (6) fits through a hole in the metal plate (4) and is insulated from it. One of the ends is coupled by a wire (7) to the surface of the semiconductor element (1). The outer rigid transparent plastics layer (3) encloses both the inner layer (2) and the metal plate (4) with the terminal pins (5,6) projecting from the rear face. The encapsulation provides protection without causing aging.
