| 摘要 |
<p>PURPOSE:To obtain semiconductor devices with extremely numerous pins by constituting lead frames with multileveled leads and insulating films insulating these leads, and connecting them with electrode pads of semiconductor pellets electrically. CONSTITUTION:An insulating film 7 is interposed between the upper-level leads 6a and the lower-level leads 6b, and the upper-level and lower-level leads 6a and 6b are insulated from each other. A plurality of unit frames being constituted every section, in this way, are arranged to compose a lead frame 1. Besides, the electrode pads 11 of a semiconductor pellet 2 are arranged in numerous lines, and these electrode pads 11 are electrically connected with the inner lead section of the lead frame 1. As this makes it possible to increase the number of input/output terminals greatly compared with the conventional technique of the leads 6a and 6b being aligned on the same plane, it becomes possible to obtain semiconductor devices with extremely numerous pins.</p> |
