发明名称 MANUFACTURE OF LATERAL SCHOTTKY DIODE
摘要 PURPOSE:To form a Schottky junction in specified shape and area at a fixed position to a cathode contact region, and to obtain excellent diode characteristics by simultaneously forming an anode contact opening and a cathode contact opening. CONSTITUTION:A silicon oxide film is shaped onto an N-type semiconductor substrate 1a, and an anode contact opening 3a and a cathode contact 4a are formed simultaneously. Only the anode contact opening and a section near the anode contact opening are covered with a photo-resist film 5. An impurity having the same conductivity type as the N-type semiconductor substrate 1a is introduced through ion implantation 10, and a cathode contact region 6a is shaped. The photo-resist film 5 is removed, a Schottky metallic film 7a is formed onto the anode contact opening, and an anode electrode 8a and a cathode electrode 9a are shaped. Accordingly, a Schottky junction having specified shape and area can be formed at a fixed position to the cathode contact region 6a, thus acquiring excellent diode characteristics.
申请公布号 JPH02178973(A) 申请公布日期 1990.07.11
申请号 JP19880331538 申请日期 1988.12.29
申请人 NEC CORP 发明人 HONJO MASAO
分类号 H01L29/872;H01L29/47;H01L29/861 主分类号 H01L29/872
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