| 发明名称 |
A SEMICONDUCTOR DEVICE COMPRISING ERASABLE MEMORY |
| 摘要 |
<p>A semiconductor device obtained by using plastic molding to obtain an ultraviolet ray erasable type EPROM semiconductor chip in which an ultraviolet ray transparent resin film is inserted between the semiconductor chip and the molding material so as to cover a portion of the surface or the whole surface of the semiconductor chip except for the surfaces of the wire bonding electrodes.</p> |
| 申请公布号 |
GB2189646(B) |
申请公布日期 |
1990.07.11 |
| 申请号 |
GB19870006061 |
申请日期 |
1987.03.13 |
| 申请人 |
* MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
SHINGO * IKEDA |
| 分类号 |
H01L23/28;G11C16/18;H01L21/8247;H01L23/29;H01L23/31;H01L29/78;H01L29/788;H01L29/792 |
主分类号 |
H01L23/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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