发明名称 METHOD AND APPARATUS FOR FORMING THIN POLYIMIDE FILM
摘要 <p>PURPOSE:To uniformize the thickness of a thin polyimide film and to improve the adhesive property thereof by supplying the vapor of polyimide raw materials consisting of plural monomers to a plasma atmosphere to ionize the vapor, transferring the ions by an electric field onto a substrate surface to stick the ions thereon and heating the substrate in this sticking process, thereby forming the thin polyimide film on the substrate. CONSTITUTION:The quartz glass substrate 5b is mounted to a substrate holder 5 and respectively adequate amts. of pyromellitic dianhydride PMDA and oxydianiline ODA are charged into two monomer housing containers 3. The inside of a vacuum chamber 1 is evacuated to a vacuum and the surface of the substrate is cleaned for several minutes by plasma. A voltage is then applied to a substrate holder 5 in such a manner that the holder serves as a negative electrode by a DC power source 17 for the electric field transfer of the ionized polyimide raw material; further, the substrate 5b is heated and held. The respective monomers are heated to evaporate and the heating rate is so controlled that the respective monomers are deposited by evaporation at each equal molar quantity to accelerate the ions of the PMDA and the ODA and the polymn. precursors thereof and to deposit the ions by evaporation on the heated substrate 5b. The thin polyimide film which is uniform even in the projecting parts of the thin film forming surface without lowering the thickness and has the excellent adhesive property is obtd. in this way.</p>
申请公布号 JPH02178630(A) 申请公布日期 1990.07.11
申请号 JP19880332347 申请日期 1988.12.29
申请人 SHARP CORP 发明人 AKAGI YOSHIRO;ISHINO MARIKO;INOUE ATSUHISA;UENISHI SHIGERU;TANIGUCHI HIROSHI
分类号 C08G73/10;G02F1/1337 主分类号 C08G73/10
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