发明名称 |
METHOD OF FABRICATING A CHIP INTERPOSER |
摘要 |
<p>Disclosed is a method of fabricating a multichip interposer comprising an insulating support with thin film fine line metallization on one side thereof. A layer of masking material is adhered to in other side and selective areas of the masking material are removed in a desired pattern to expose areas of the support. The exposed areas of the support are then etched until the metallization is reached to form via holes which are subsequently filled with interconnecting metallurgy. Contact pads are then formed around each filled via hole.</p> |
申请公布号 |
EP0171662(B1) |
申请公布日期 |
1990.07.11 |
申请号 |
EP19850109180 |
申请日期 |
1985.07.23 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GELDERMANS, PIETER;MATHAD, GANGADHARA SWAMI |
分类号 |
H01L21/52;H01L21/48;H01L21/58;H01L21/60;H01L23/32;H01L23/498;H01L23/538;H01L25/04;H01L25/18;H05K1/00;H05K1/03;H05K1/11;H05K3/00 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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