| 摘要 |
PURPOSE:To achieve an improved outer bonding constantly by providing a metal plate for cooling at the periphery part of a device hole. CONSTITUTION:After punching a device hole 6 and a sprocket hole 7 on a polyimide film 5 and copper foil is adhered to the entire surface, a lead frame 3 of a specified shape, a copper plate for cooling 4, and a plating wire 8 are formed by the etching and plating techniques. The copper plate 4 is formed at a region including the periphery part of the hole 6 and is connected to the wire 8. Then, a bump 2 and the lead frame 3 formed at a semiconductor chip 1 are subjected to inner lead bonding by a bonding tool. This configuration prevents heat expansion of the lead frame and heat shrinkage and deformation of the film caused by heat transmitted from a bonding tool for the copper plate 4. Thus, the pitch between the leads is maintained to a specified gap, thus achieving a constantly improved outer bonding. |
