Lead frame conveying apparatus

摘要

An improved lead frame conveying apparatus for conveying a lead frame to a bonding position has two pins each with a tapered end which is provided for being inserted into a positioning hole in a lead frame. The tapered end has an upper portion the diameter of which is smaller than the diameter of the positioning hole in the lead frame and a lower portion the diameter of which is larger than the diameter of the positioning hole. The lead frame is supported by the tapered ends of the pins which engage the round edges of the positioning holes. The tapered pins are moved controllably in this state, thereby feeding the lead frame to the bonding position. Since the weight of lead frame tends to push the lead frame down on the pins, the centers of the positioining holes and the tapered pins become automatically aligned, bringing about correct aligning of the lead frame.